NAND256W3A0CZA6T
vs
NAND256W3A0BZA6F
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NUMONYX
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
8 X 10 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-55
VFBGA-55
Pin Count
55
55
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
35 ns
35 ns
JESD-30 Code
R-PBGA-B55
R-PBGA-B55
Length
10 mm
10 mm
Memory Density
268435456 bit
268435456 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
55
55
Number of Words
33554432 words
33554432 words
Number of Words Code
32000000
32000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
32MX8
32MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.05 mm
1.05 mm
Supply Current-Max
0.02 mA
0.02 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Type
SLC NAND TYPE
SLC NAND TYPE
Width
8 mm
8 mm
Base Number Matches
2
3
Command User Interface
YES
Data Polling
NO
JESD-609 Code
e1
Number of Sectors/Size
2K
Package Equivalence Code
BGA55,8X12,32
Page Size
512 words
Ready/Busy
YES
Sector Size
16K
Standby Current-Max
0.00005 A
Terminal Finish
TIN SILVER COPPER
Toggle Bit
NO
Compare NAND256W3A0CZA6T with alternatives
Compare NAND256W3A0BZA6F with alternatives