NAND256W3A0BV6F
vs
NAND256R3A1BN6
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
SOIC
TSOP
Package Description
12 X 17 MM, 0.65 MM HEIGHT, ROHS COMPLIANT, PLASTIC, USOP-48
TSOP1,
Pin Count
48
48
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
35 ns
15000 ns
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
Length
15.4 mm
18.4 mm
Memory Density
268435456 bit
268435456 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
33554432 words
33554432 words
Number of Words Code
32000000
32000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
32MX8
32MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSSOP
TSOP1
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
3 V
1.8 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.65 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
1.95 V
Supply Voltage-Min (Vsup)
2.7 V
1.65 V
Supply Voltage-Nom (Vsup)
3 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Type
SLC NAND TYPE
Width
12 mm
12 mm
Base Number Matches
1
4
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare NAND256W3A0BV6F with alternatives
Compare NAND256R3A1BN6 with alternatives