NAND256W3A0AZA1
vs
NAND256W3A2AZA6T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
BGA
BGA
Package Description
8 X 10 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-55
8 X 10 MM, 1 MM HEIGHT, 0.80 MM PITCH, VFBGA-55
Pin Count
55
55
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
35 ns
35 ns
Command User Interface
YES
YES
Data Polling
NO
NO
JESD-30 Code
R-PBGA-B55
R-PBGA-B55
JESD-609 Code
e0
e0
Length
10 mm
10 mm
Memory Density
268435456 bit
268435456 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Sectors/Size
2K
2K
Number of Terminals
55
55
Number of Words
33554432 words
33554432 words
Number of Words Code
32000000
32000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
32MX8
32MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA55,8X12,32
BGA55,8X12,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Page Size
512 words
512 words
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
YES
Seated Height-Max
1.05 mm
1.05 mm
Sector Size
16K
16K
Standby Current-Max
0.00005 A
0.00005 A
Supply Current-Max
0.02 mA
0.02 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
NO
NO
Type
SLC NAND TYPE
SLC NAND TYPE
Width
8 mm
8 mm
Base Number Matches
2
2
Compare NAND256W3A0AZA1 with alternatives
Compare NAND256W3A2AZA6T with alternatives