NAND128R4A0CN1E vs NAND128R4A0BV1 feature comparison

NAND128R4A0CN1E STMicroelectronics

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NAND128R4A0BV1 STMicroelectronics

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Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer STMICROELECTRONICS STMICROELECTRONICS
Part Package Code TSOP SOIC
Package Description TSOP1, VSSOP,
Pin Count 48 48
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 35 ns 35 ns
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e3/e6 e0
Length 18.4 mm 15.4 mm
Memory Density 134217728 bit 134217728 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8MX16 8MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 VSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 1.8 V 1.8 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 0.65 mm
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN/TIN BISMUTH TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type SLC NAND TYPE SLC NAND TYPE
Width 12 mm 12 mm
Base Number Matches 2 2

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