NAND04GR4B2DN6E
vs
NAND04GR3B2DN1F
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
MICRON TECHNOLOGY INC
|
| Package Description |
,
|
TSSOP, TSSOP48,.8,20
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Base Number Matches |
3
|
3
|
| Rohs Code |
|
Yes
|
| Access Time-Max |
|
30 ns
|
| Command User Interface |
|
YES
|
| Data Polling |
|
NO
|
| JESD-30 Code |
|
R-PDSO-G48
|
| Memory Density |
|
4294967296 bit
|
| Memory IC Type |
|
FLASH
|
| Memory Width |
|
8
|
| Number of Sectors/Size |
|
4K
|
| Number of Terminals |
|
48
|
| Number of Words |
|
536870912 words
|
| Number of Words Code |
|
512000000
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
|
512MX8
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Equivalence Code |
|
TSSOP48,.8,20
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Page Size |
|
2K words
|
| Parallel/Serial |
|
PARALLEL
|
| Qualification Status |
|
Not Qualified
|
| Ready/Busy |
|
YES
|
| Sector Size |
|
128K
|
| Standby Current-Max |
|
0.00005 A
|
| Supply Current-Max |
|
0.02 mA
|
| Supply Voltage-Nom (Vsup) |
|
1.8 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
DUAL
|
| Toggle Bit |
|
NO
|
|
|
|
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