NAND04GR4B2DN6E
vs
MBM29DL400BC-90PFTN
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
SPANSION INC
|
| Package Description |
,
|
PLASTIC, TSOP1-48
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Base Number Matches |
3
|
3
|
| Rohs Code |
|
No
|
| Part Package Code |
|
TSOP1
|
| Pin Count |
|
48
|
| Access Time-Max |
|
90 ns
|
| Alternate Memory Width |
|
8
|
| Boot Block |
|
BOTTOM
|
| Command User Interface |
|
YES
|
| Data Polling |
|
YES
|
| JESD-30 Code |
|
R-PDSO-G48
|
| JESD-609 Code |
|
e0
|
| Length |
|
18.4 mm
|
| Memory Density |
|
4194304 bit
|
| Memory IC Type |
|
FLASH
|
| Memory Width |
|
16
|
| Number of Functions |
|
1
|
| Number of Sectors/Size |
|
2,4,2,6
|
| Number of Terminals |
|
48
|
| Number of Words |
|
262144 words
|
| Number of Words Code |
|
256000
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
256KX16
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSOP1
|
| Package Equivalence Code |
|
TSSOP48,.8,20
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE
|
| Parallel/Serial |
|
PARALLEL
|
| Programming Voltage |
|
3 V
|
| Qualification Status |
|
Not Qualified
|
| Ready/Busy |
|
YES
|
| Seated Height-Max |
|
1.2 mm
|
| Sector Size |
|
16K,8K,32K,64K
|
| Standby Current-Max |
|
0.000005 A
|
| Supply Current-Max |
|
0.045 mA
|
| Supply Voltage-Max (Vsup) |
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
|
3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
DUAL
|
| Toggle Bit |
|
YES
|
| Type |
|
NOR TYPE
|
| Width |
|
12 mm
|
|
|
|
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