NAND04GR3B2DN1F
vs
NAND04GW4B2DN6E
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NUMONYX
|
MICRON TECHNOLOGY INC
|
| Part Package Code |
TSOP
|
|
| Package Description |
TSSOP, TSSOP48,.8,20
|
,
|
| Pin Count |
48
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
25000 ns
|
|
| Command User Interface |
YES
|
|
| Data Polling |
NO
|
|
| JESD-30 Code |
R-PDSO-G48
|
|
| Length |
18.4 mm
|
|
| Memory Density |
4294967296 bit
|
|
| Memory IC Type |
FLASH
|
|
| Memory Width |
8
|
|
| Number of Functions |
1
|
|
| Number of Sectors/Size |
4K
|
|
| Number of Terminals |
48
|
|
| Number of Words |
536870912 words
|
|
| Number of Words Code |
512000000
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
512MX8
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TSSOP
|
|
| Package Equivalence Code |
TSSOP48,.8,20
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
|
| Page Size |
2K words
|
|
| Parallel/Serial |
PARALLEL
|
|
| Programming Voltage |
1.8 V
|
|
| Qualification Status |
Not Qualified
|
|
| Ready/Busy |
YES
|
|
| Seated Height-Max |
1.2 mm
|
|
| Sector Size |
128K
|
|
| Standby Current-Max |
0.00005 A
|
|
| Supply Current-Max |
0.02 mA
|
|
| Supply Voltage-Max (Vsup) |
1.95 V
|
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
DUAL
|
|
| Toggle Bit |
NO
|
|
| Width |
12 mm
|
|
| Base Number Matches |
3
|
3
|
|
|
|
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