NAND02GW4B2BN1F
vs
S30MS02GR25TFW010
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
SPANSION INC
Part Package Code
TSOP
TSOP1
Package Description
TSSOP,
LEAD FREE, MO-142DDD, TSOP-48
Pin Count
48
48
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
35 ns
25 ns
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
JESD-609 Code
e3
e3
Length
18.4 mm
18.4 mm
Memory Density
2147483648 bit
2097152 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
8
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
134217728 words
262144 words
Number of Words Code
128000000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-25 °C
Organization
128MX16
256KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
1.8 V
Seated Height-Max
1.2 mm
1.2 mm
Supply Current-Max
0.03 mA
0.05 mA
Supply Voltage-Max (Vsup)
3.6 V
1.95 V
Supply Voltage-Min (Vsup)
2.7 V
1.7 V
Supply Voltage-Nom (Vsup)
3 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
OTHER
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Type
NAND TYPE
Width
12 mm
12 mm
Base Number Matches
1
1
Command User Interface
YES
Data Polling
NO
Moisture Sensitivity Level
3
Number of Sectors/Size
2K
Package Equivalence Code
TSSOP48,.8,20
Page Size
1K words
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Ready/Busy
YES
Sector Size
64K
Standby Current-Max
0.00006 A
Time@Peak Reflow Temperature-Max (s)
40
Toggle Bit
NO
Compare NAND02GW4B2BN1F with alternatives
Compare S30MS02GR25TFW010 with alternatives