NAND02GR4B2BN1E vs HY27UF082G2M-TPCP feature comparison

NAND02GR4B2BN1E STMicroelectronics

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HY27UF082G2M-TPCP SK Hynix Inc

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer STMICROELECTRONICS SK HYNIX INC
Part Package Code TSOP TSOP1
Package Description TSOP1, TSOP1, TSSOP48,.8,20
Pin Count 48 48
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 25000 ns 30 ns
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e3 e6
Length 18.4 mm 18.4 mm
Memory Density 2147483648 bit 2147483648 bit
Memory IC Type FLASH FLASH
Memory Width 16 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 134217728 words 268435456 words
Number of Words Code 128000000 256000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 128MX16 256MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 1.8 V 3.3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 1.95 V 3.6 V
Supply Voltage-Min (Vsup) 1.7 V 2.7 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN TIN BISMUTH
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Width 12 mm 12 mm
Base Number Matches 1 1
Additional Feature CONTAINS ADDITIONAL 512M BIT SPARE MEMORY
Command User Interface YES
Data Polling NO
Number of Sectors/Size 2K
Package Equivalence Code TSSOP48,.8,20
Page Size 2K words
Ready/Busy YES
Sector Size 128K
Standby Current-Max 0.00005 A
Supply Current-Max 0.03 mA
Toggle Bit NO
Type SLC NAND TYPE

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