NAND01GW4A2BZB1F
vs
NAND01GR4B2AZA6F
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
STMICROELECTRONICS
NUMONYX
Part Package Code
BGA
BGA
Package Description
TFBGA,
TFBGA,
Pin Count
63
63
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
35 ns
25000 ns
JESD-30 Code
R-PBGA-B63
R-PBGA-B63
JESD-609 Code
e1
e1
Length
11 mm
12 mm
Memory Density
1073741824 bit
1073741824 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
63
63
Number of Words
67108864 words
67108864 words
Number of Words Code
64000000
64000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
64MX16
64MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
1.8 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.05 mm
Supply Voltage-Max (Vsup)
3.6 V
1.95 V
Supply Voltage-Min (Vsup)
2.7 V
1.7 V
Supply Voltage-Nom (Vsup)
3 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Type
SLC NAND TYPE
Width
9 mm
9.5 mm
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare NAND01GW4A2BZB1F with alternatives
Compare NAND01GR4B2AZA6F with alternatives