NAND01GR4B3CZA6F
vs
NAND01GR4A2CZB1E
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NUMONYX
STMICROELECTRONICS
Part Package Code
BGA
BGA
Package Description
TFBGA,
9 X 11 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-63
Pin Count
63
63
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
35 ns
35 ns
JESD-30 Code
R-PBGA-B63
R-PBGA-B63
Length
12 mm
11 mm
Memory Density
1073741824 bit
1073741824 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
63
63
Number of Words
67108864 words
67108864 words
Number of Words Code
64000000
64000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
64MX16
64MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
1.8 V
1.8 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.05 mm
1.2 mm
Supply Current-Max
0.015 mA
Supply Voltage-Max (Vsup)
1.95 V
1.95 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Type
NAND TYPE
SLC NAND TYPE
Width
9.5 mm
9 mm
Base Number Matches
2
2
JESD-609 Code
e1
Terminal Finish
TIN SILVER COPPER
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