NAND01GR4B2BN1 vs NAND01GR4A2CN1F feature comparison

NAND01GR4B2BN1 Micron Technology Inc

Buy Now Datasheet

NAND01GR4A2CN1F STMicroelectronics

Buy Now Datasheet
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICRON TECHNOLOGY INC STMICROELECTRONICS
Part Package Code TSOP TSOP
Package Description TSSOP, TSOP1,
Pin Count 48 48
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
JESD-30 Code R-PDSO-G48 R-PDSO-G48
Length 18.4 mm 18.4 mm
Memory Density 1073741824 bit 1073741824 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 67108864 words 67108864 words
Number of Words Code 64000000 64000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64MX16 64MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 1.8 V 1.8 V
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Width 12 mm 12 mm
Base Number Matches 3 2
Pbfree Code Yes
Rohs Code Yes
Access Time-Max 35 ns
JESD-609 Code e3/e6
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Terminal Finish TIN/TIN BISMUTH
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type SLC NAND TYPE

Compare NAND01GR4B2BN1 with alternatives

Compare NAND01GR4A2CN1F with alternatives