NAND01GR4A2DZA1T
vs
NAND01GR4A0AZB6E
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
BGA
BGA
Package Description
BGA,
9 X 11 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-63
Pin Count
63
63
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
15000 ns
35 ns
JESD-30 Code
R-PBGA-B63
R-PBGA-B63
JESD-609 Code
e0
e1
Memory Density
1073741824 bit
1073741824 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
63
63
Number of Words
67108864 words
67108864 words
Number of Words Code
64000000
64000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
64MX16
64MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
1.8 V
1.8 V
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
1.95 V
1.95 V
Supply Voltage-Min (Vsup)
1.65 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
1
1
Command User Interface
YES
Data Polling
NO
Length
11 mm
Number of Sectors/Size
8K
Package Equivalence Code
BGA63,10X12,32
Page Size
256 words
Ready/Busy
YES
Seated Height-Max
1.2 mm
Sector Size
8K
Standby Current-Max
0.0001 A
Supply Current-Max
0.015 mA
Terminal Pitch
0.8 mm
Toggle Bit
NO
Type
SLC NAND TYPE
Width
9 mm
Compare NAND01GR4A2DZA1T with alternatives
Compare NAND01GR4A0AZB6E with alternatives