NAND01GR4A1CZA6E
vs
NAND01GR4A0DZA6
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
NUMONYX
Part Package Code
BGA
BGA
Package Description
BGA,
BGA,
Pin Count
63
63
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Total Weight
160
Category CO2 Kg
12
12
CO2
1920
Compliance Temperature Grade
Industrial: -40C to +85C
Industrial: -40C to +85C
EU RoHS Version
RoHS 2 (2015/863/EU)
Candidate List Date
2024-06-27
SVHC Over MCV
79-94-7
CAS Accounted for Wt
73
CA Prop 65 Presence
YES
CA Prop 65 CAS Numbers
79-94-7, 1309-64-4, 7440-02-0
EFUP
e
Conflict Mineral Status
DRC Conflict Free
Conflict Mineral Status Source
CMRT V3.02
Access Time-Max
15000 ns
15000 ns
JESD-30 Code
R-PBGA-B63
R-PBGA-B63
JESD-609 Code
e1
e0
Memory Density
1073741824 bit
1073741824 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
63
63
Number of Words
67108864 words
67108864 words
Number of Words Code
64000000
64000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
64MX16
64MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
1.8 V
1.8 V
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
1.95 V
1.95 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
2
2
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Type
NAND TYPE
Compare NAND01GR4A1CZA6E with alternatives
Compare NAND01GR4A0DZA6 with alternatives