NAND01GR4A1CZA1F vs AM29LV640GU53RWHF feature comparison

NAND01GR4A1CZA1F Numonyx Memory Solutions

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AM29LV640GU53RWHF Spansion

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NUMONYX SPANSION INC
Part Package Code BGA BGA
Package Description BGA, 11 X 12 MM, 0.80 MM PITCH, FBGA-63
Pin Count 63 63
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 15000 ns 55 ns
JESD-30 Code R-PBGA-B63 R-PBGA-B63
JESD-609 Code e1 e1
Memory Density 1073741824 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 63 63
Number of Words 67108864 words 4194304 words
Number of Words Code 64000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 64MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 1.8 V 3 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 1.95 V 3.6 V
Supply Voltage-Min (Vsup) 1.65 V 3 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 1 1
Rohs Code Yes
Boot Block BOTTOM/TOP
Length 12 mm
Moisture Sensitivity Level 3
Seated Height-Max 1.2 mm
Terminal Pitch 0.8 mm
Type NOR TYPE
Width 11 mm

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Compare AM29LV640GU53RWHF with alternatives