NAND01GR3A3CZA1T
vs
NAND01GR3A2BZA1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
NUMONYX
Part Package Code
BGA
BGA
Package Description
BGA,
BGA,
Pin Count
63
63
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Category CO2 Kg
12
12
Compliance Temperature Grade
Commercial: +0C to +70C
Commercial: +0C to +70C
Candidate List Date
2011-06-20
EFUP
50
Conflict Mineral Status
DRC Conflict Free
Conflict Mineral Status Source
CMRT V3.02
Access Time-Max
15000 ns
15000 ns
JESD-30 Code
R-PBGA-B63
R-PBGA-B63
JESD-609 Code
e0
Memory Density
1073741824 bit
1073741824 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
63
63
Number of Words
134217728 words
134217728 words
Number of Words Code
128000000
128000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
128MX8
128MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
1.8 V
1.8 V
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
1.95 V
1.95 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
2
2
Type
NAND TYPE
Compare NAND01GR3A3CZA1T with alternatives
Compare NAND01GR3A2BZA1 with alternatives