N8X350N
vs
8X350/BWA
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
PHILIPS COMPONENTS
|
NXP SEMICONDUCTORS
|
Package Description |
,
|
,
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
3A001.A.2.C
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
JESD-30 Code |
R-PDIP-T22
|
R-CDIP-T22
|
Memory Density |
2048 bit
|
2048 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
|
Number of Terminals |
22
|
22
|
Number of Words |
256 words
|
256 words
|
Number of Words Code |
256
|
256
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
75 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Organization |
256X8
|
256X8
|
Output Characteristics |
3-STATE
|
|
Output Enable |
NO
|
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
|
Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
Supply Voltage-Min (Vsup) |
4.75 V
|
4.75 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
TTL
|
TTL
|
Temperature Grade |
COMMERCIAL EXTENDED
|
MILITARY
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
4
|
4
|
|
|
|
Compare N8X350N with alternatives
Compare 8X350/BWA with alternatives