N82S23B vs AM27S18APC feature comparison

N82S23B NXP Semiconductors

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AM27S18APC AMD

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP ADVANCED MICRO DEVICES INC
Package Description , DIP, DIP16,.3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 50 ns 25 ns
JESD-30 Code R-PDIP-T16 R-PDIP-T16
Memory Density 256 bit 256 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 32 words 32 words
Number of Words Code 32 32
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 75 °C 75 °C
Operating Temperature-Min
Organization 32X8 32X8
Output Characteristics OPEN-COLLECTOR OPEN-COLLECTOR
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 4
Pbfree Code No
Rohs Code No
Part Package Code DIP
Pin Count 16
JESD-609 Code e0
Length 19.1135 mm
Package Code DIP
Package Equivalence Code DIP16,.3
Seated Height-Max 5.08 mm
Supply Current-Max 0.115 mA
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

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