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N82S191ANB vs M38510/21004BJA feature comparison

N82S191ANB Philips Semiconductors

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M38510/21004BJA Lansdale Semiconductor Inc

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Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer SIGNETICS CORP LANSDALE SEMICONDUCTOR INC
Package Description DIP, DIP24,.6 0.5 X 0.75 INCH, DIP-24
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 55 ns 80 ns
JESD-30 Code R-PDIP-T24 R-XDIP-T24
JESD-609 Code e0 e0
Memory Density 16384 bit 262144 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 2048 words 2048 words
Number of Words Code 2000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -55 °C
Organization 2KX8 32KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code DIP DIP
Package Equivalence Code DIP24,.6 DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Qualified
Supply Current-Max 0.175 mA
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL EXTENDED MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 4
Part Package Code DIP
Pin Count 24
Screening Level MIL-M-38510 Class B
Memory » OTP ROMs
Memory » OTP ROMs

Compare N82S191ANB with alternatives

Compare M38510/21004BJA with alternatives