N82S191AN vs M38510/21004BJX feature comparison

N82S191AN YAGEO Corporation

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M38510/21004BJX NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer PHILIPS COMPONENTS NXP SEMICONDUCTORS
Package Description DIP-24 DIP,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 55 ns 180 ns
JESD-30 Code R-PDIP-T24 R-XDIP-T24
Memory Density 16384 bit 65536 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 2048 words 2048 words
Number of Words Code 2000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -55 °C
Organization 2KX8 8KX8
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL EXTENDED MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Part Package Code DIP
Pin Count 24
Package Code DIP
Screening Level MIL-M-38510 Class B
Supply Current-Max 0.185 mA

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Compare M38510/21004BJX with alternatives