N82S191A
vs
TBP28L166NW
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
TEXAS INSTRUMENTS INC
|
Package Description |
QCCJ, LDCC28,.5SQ
|
DIP, DIP24,.6
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
Access Time-Max |
80 ns
|
65 ns
|
JESD-30 Code |
S-PQCC-J28
|
R-PDIP-T24
|
JESD-609 Code |
e0
|
|
Memory Density |
16384 bit
|
4096 bit
|
Memory IC Type |
OTP ROM
|
OTP ROM
|
Memory Width |
8
|
8
|
Number of Terminals |
28
|
24
|
Number of Words |
2048 words
|
2048 words
|
Number of Words Code |
2000
|
512
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
2KX8
|
512X8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
DIP
|
Package Equivalence Code |
LDCC28,.5SQ
|
DIP24,.6
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Current-Max |
0.175 mA
|
0.1 mA
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
TTL
|
BIPOLAR
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
J BEND
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Base Number Matches |
3
|
1
|
Part Package Code |
|
DIP
|
Pin Count |
|
24
|
Length |
|
31.75 mm
|
Number of Functions |
|
1
|
Operating Mode |
|
ASYNCHRONOUS
|
Parallel/Serial |
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Seated Height-Max |
|
5.08 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Width |
|
15.24 mm
|
|
|
|
Compare N82S191A with alternatives
Compare TBP28L166NW with alternatives