N82S16NB vs S54S200F feature comparison

N82S16NB NXP Semiconductors

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S54S200F Philips Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP SIGNETICS CORP
Package Description DIP, DIP16,.3 ,
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 50 ns 70 ns
JESD-30 Code R-PDIP-T16 R-GDIP-T16
JESD-609 Code e0
Memory Density 256 bit 256 bit
Memory IC Type CACHE SRAM STANDARD SRAM
Memory Width 1 1
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 16 16
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -55 °C
Organization 256X1 256X1
Output Characteristics 3-STATE 3-STATE
Output Enable NO NO
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.115 mA
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL EXTENDED MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 3

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