N82S137N
vs
53S441AW883B
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
MONOLITHIC MEMORIES
|
| Package Description |
DIP, DIP18,.3
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.71
|
|
| Access Time-Max |
60 ns
|
55 ns
|
| JESD-30 Code |
R-PDIP-T18
|
R-GDFP-F18
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
4096 bit
|
65536 bit
|
| Memory IC Type |
OTP ROM
|
OTP ROM
|
| Memory Width |
4
|
8
|
| Number of Terminals |
18
|
18
|
| Number of Words |
1024 words
|
1024 words
|
| Number of Words Code |
1000
|
8000
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
1KX4
|
8KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DFP
|
| Package Equivalence Code |
DIP18,.3
|
FL18,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
0.14 mA
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
TTL
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
FLAT
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
4
|
1
|
| Number of Functions |
|
1
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Parallel/Serial |
|
PARALLEL
|
| Screening Level |
|
38535Q/M;38534H;883B
|
|
|
|
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