N82S136F vs TBP24SA41N feature comparison

N82S136F NXP Semiconductors

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TBP24SA41N Texas Instruments

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP TEXAS INSTRUMENTS INC
Package Description DIP, DIP18,.3 DIP, DIP18,.3
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 60 ns 65 ns
JESD-30 Code R-CDIP-T18 R-PDIP-T18
JESD-609 Code e0
Memory Density 4096 bit 8192 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 4 4
Number of Functions 1 1
Number of Terminals 18 18
Number of Words 1024 words 1024 words
Number of Words Code 1000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 75 °C 70 °C
Operating Temperature-Min
Organization 1KX4 2KX4
Output Characteristics OPEN-COLLECTOR
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP18,.3 DIP18,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 1
Part Package Code DIP
Pin Count 18
Length 22.48 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 5.08 mm
Supply Current-Max 0.1 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

Compare N82S136F with alternatives

Compare TBP24SA41N with alternatives