N82S135NB vs MB7117EM feature comparison

N82S135NB Philips Semiconductors

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MB7117EM FUJITSU Limited

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP FUJITSU LTD
Package Description DIP, DIP20,.3 DIP, DIP20,.3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 45 ns 45 ns
JESD-30 Code R-PDIP-T20 R-PDIP-T20
JESD-609 Code e0 e0
Memory Density 2048 bit 2048 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1
Number of Terminals 20 20
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 75 °C 70 °C
Operating Temperature-Min
Organization 256X8 256X8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.15 mA 0.14 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR TTL
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 2
Part Package Code DIP
Pin Count 20

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