N82S135N vs TBP28LA22N1 feature comparison

N82S135N NXP Semiconductors

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TBP28LA22N1 Rochester Electronics LLC

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 45 ns
JESD-30 Code R-PDIP-T20
JESD-609 Code e0
Memory Density 2048 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 20
Number of Words 256 words
Number of Words Code 256
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 75 °C
Operating Temperature-Min
Organization 256X8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP20,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Supply Current-Max 0.15 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology BIPOLAR
Temperature Grade COMMERCIAL EXTENDED
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Base Number Matches 4 2
Package Description ,

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