N82S135N vs MB7118EM feature comparison

N82S135N Philips Semiconductors

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MB7118EM FUJITSU Limited

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS FUJITSU LTD
Package Description DIP-20 DIP, DIP20,.3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 45 ns 45 ns
JESD-30 Code R-PDIP-T20 R-PDIP-T20
JESD-609 Code e0 e0
Memory Density 2048 bit 2048 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Terminals 20 20
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256X8 256X8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.15 mA 0.14 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 4 2
Part Package Code DIP
Pin Count 20
Number of Functions 1
Operating Mode ASYNCHRONOUS
Parallel/Serial PARALLEL

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