N82S131N
vs
M38510/20403BEA
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
QP SEMICONDUCTOR INC
Package Description
DIP-16
DIP,
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
50 ns
35 ns
JESD-30 Code
R-PDIP-T16
R-XDIP-T16
JESD-609 Code
e0
e0
Memory Density
2048 bit
2048 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
4
4
Number of Terminals
16
16
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
512X4
512X4
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max
0.14 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
BIPOLAR
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
4
1
Part Package Code
DIP
Pin Count
16
Number of Functions
1
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
Screening Level
MIL-M-38510 Class B
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Compare N82S131N with alternatives
Compare M38510/20403BEA with alternatives