N82S130N vs AM27S13PC feature comparison

N82S130N Philips Semiconductors

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AM27S13PC AMD

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS ADVANCED MICRO DEVICES INC
Package Description DIP-16 DIP, DIP16,.3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 50 ns 200 ns
JESD-30 Code R-PDIP-T16 R-PDIP-T16
JESD-609 Code e0 e0
Memory Density 2048 bit 1048576 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 4 8
Number of Terminals 16 16
Number of Words 512 words 512 words
Number of Words Code 512 128000
Operating Temperature-Max 70 °C 75 °C
Operating Temperature-Min
Organization 512X4 128KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.14 mA 0.13 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL EXTENDED
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 4 1
Pbfree Code No
Part Package Code DIP
Pin Count 16
Length 19.05 mm
Number of Functions 1
Operating Mode ASYNCHRONOUS
Output Characteristics 3-STATE
Parallel/Serial PARALLEL
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Width 7.62 mm

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