N82S09ANB
vs
82S09/BYA
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SIGNETICS CORP
|
SIGNETICS CORP
|
| Package Description |
DIP, DIP28,.6
|
DFP, FL28,.4
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
35 ns
|
80 ns
|
| JESD-30 Code |
R-PDIP-T28
|
R-XDFP-F28
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
576 bit
|
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
9
|
9
|
| Number of Functions |
1
|
|
| Number of Ports |
1
|
|
| Number of Terminals |
28
|
28
|
| Number of Words |
64 words
|
64 words
|
| Number of Words Code |
64
|
64
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
75 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
64X9
|
64X9
|
| Output Characteristics |
OPEN-COLLECTOR
|
OPEN-COLLECTOR
|
| Output Enable |
NO
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
| Package Code |
DIP
|
DFP
|
| Package Equivalence Code |
DIP28,.6
|
FL28,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
FLATPACK
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
0.19 mA
|
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
FLAT
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
3
|
4
|
| Screening Level |
|
38535Q/M;38534H;883B
|
|
|
|
Compare N82S09ANB with alternatives
Compare 82S09/BYA with alternatives