N82HS641F
vs
27HC641L-55/P
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
PHILIPS COMPONENTS
MICROCHIP TECHNOLOGY INC
Package Description
,
PLASTIC, DIP-24
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
55 ns
55 ns
JESD-30 Code
R-GDIP-T24
R-PDIP-T24
Memory Density
65536 bit
65536 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
75 °C
70 °C
Operating Temperature-Min
Organization
8KX8
8KX8
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
WDIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
BIPOLAR
CMOS
Temperature Grade
COMMERCIAL EXTENDED
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
4
1
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
24
I/O Type
COMMON
JESD-609 Code
e0
Output Characteristics
3-STATE
Package Equivalence Code
DIP24,.6
Standby Current-Max
0.0001 A
Supply Current-Max
0.094 mA
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Compare N82HS641F with alternatives
Compare 27HC641L-55/P with alternatives