N82HS321NB vs 8200803JA feature comparison

N82HS321NB Philips Semiconductors

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8200803JA AMD

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP ADVANCED MICRO DEVICES INC
Package Description DIP, DIP24,.6 DIP,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 45 ns 35 ns
JESD-30 Code R-PDIP-T24 R-GDIP-T24
JESD-609 Code e0
Memory Density 32768 bit 8192 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 4096 words 4096 words
Number of Words Code 4000 1000
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -55 °C
Organization 4KX8 1KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.175 mA 0.19 mA
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL EXTENDED MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 6
Part Package Code DIP
Pin Count 24
Screening Level MIL-STD-883

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