N82HS321F
vs
R29771SM
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
RAYTHEON SEMICONDUCTOR
|
Package Description |
DIP, DIP24,.6
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.32.00.71
|
|
Access Time-Max |
45 ns
|
85 ns
|
JESD-30 Code |
R-XDIP-T24
|
R-CDIP-T24
|
JESD-609 Code |
e0
|
e0
|
Memory Density |
32768 bit
|
32768 bit
|
Memory IC Type |
OTP ROM
|
OTP ROM
|
Memory Width |
8
|
8
|
Number of Terminals |
24
|
24
|
Number of Words |
4096 words
|
4096 words
|
Number of Words Code |
4000
|
4000
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Organization |
4KX8
|
4KX8
|
Package Body Material |
CERAMIC
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP24,.6
|
DIP24,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Current-Max |
0.175 mA
|
0.19 mA
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
TTL
|
BIPOLAR
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
4
|
3
|
Number of Functions |
|
1
|
Operating Mode |
|
ASYNCHRONOUS
|
Parallel/Serial |
|
PARALLEL
|
Supply Voltage-Max (Vsup) |
|
5.5 V
|
Supply Voltage-Min (Vsup) |
|
4.5 V
|
|
|
|
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