N82HS187AN
vs
63RS881AJSXXXX
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
|
| Package Description |
DIP, DIP24,.3
|
|
| Reach Compliance Code |
unknown
|
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.71
|
|
| JESD-30 Code |
R-PDIP-T24
|
|
| JESD-609 Code |
e0
|
|
| Memory Density |
8192 bit
|
|
| Memory IC Type |
OTP ROM
|
|
| Memory Width |
8
|
|
| Number of Terminals |
24
|
|
| Number of Words |
1024 words
|
|
| Number of Words Code |
1000
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
1KX8
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP24,.3
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE
|
|
| Qualification Status |
Not Qualified
|
|
| Supply Current-Max |
0.175 mA
|
|
| Surface Mount |
NO
|
|
| Technology |
TTL
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
|
| Base Number Matches |
3
|
|
|
|
|