N82503
vs
S82503
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
| Part Package Code |
LCC
|
QFP
|
| Package Description |
PLASTIC, LCC-44
|
QFP-44
|
| Pin Count |
44
|
44
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
|
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
20 MHz
|
20 MHz
|
| Data Encoding/Decoding Method |
NRZ; BIPH-LEVEL (MANCHESTER)
|
NRZ; BIPH-LEVEL (MANCHESTER)
|
| Data Transfer Rate-Max |
1.25 MBps
|
1.25 MBps
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQCC-J44
|
S-PQFP-G44
|
| JESD-609 Code |
e0
|
e0
|
| Length |
16.6 mm
|
10 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of DMA Channels |
|
|
| Number of I/O Lines |
|
|
| Number of Serial I/Os |
3
|
3
|
| Number of Terminals |
44
|
44
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
0
|
| Seated Height-Max |
4.57 mm
|
2.35 mm
|
| Supply Current-Max |
75 mA
|
75 mA
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
16.6 mm
|
10 mm
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
| Base Number Matches |
1
|
1
|
|
|
|