N8200F vs S8200F feature comparison

N8200F NXP Semiconductors

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S8200F NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP SIGNETICS CORP
Package Description DIP, DIP24,.6 ,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 82 82
JESD-30 Code R-GDIP-T24 R-GDIP-T24
JESD-609 Code e0
Load Capacitance (CL) 18 pF 18 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 5 5
Number of Functions 2 2
Number of Terminals 24 24
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -55 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 110 mA 110 mA
Propagation Delay (tpd) 45 ns 45 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL EXTENDED MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Trigger Type NEGATIVE EDGE NEGATIVE EDGE
Base Number Matches 3 3

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