N74LVC163PW vs IDT74LVC161APGG feature comparison

N74LVC163PW NXP Semiconductors

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IDT74LVC161APGG Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTEGRATED DEVICE TECHNOLOGY INC
Package Description TSSOP, TSSOP-16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature TCO OUTPUT TCO OUTPUT
Count Direction UP UP
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 5 mm 5 mm
Load Capacitance (CL) 50 pF
Load/Preset Input YES YES
Logic IC Type BINARY COUNTER BINARY COUNTER
Mode of Operation SYNCHRONOUS SYNCHRONOUS
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 8 ns 9 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 4.4 mm 4.4 mm
fmax-Min 125 MHz 68.97 MHz
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code TSSOP
Pin Count 16
JESD-609 Code e3
Moisture Sensitivity Level 1
Output Characteristics 3-STATE
Peak Reflow Temperature (Cel) 260
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 40

Compare N74LVC163PW with alternatives

Compare IDT74LVC161APGG with alternatives