N74LVC109DB
vs
SN74LVC112ADRE4
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
TEXAS INSTRUMENTS INC
Part Package Code
SOIC
SOIC
Package Description
SSOP,
SOP, SOP16,.25
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Length
6.2 mm
9.9 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
J-KBAR FLIP-FLOP
J-K FLIP-FLOP
Number of Bits
2
2
Number of Functions
2
2
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE
Propagation Delay (tpd)
7.5 ns
7.1 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
1.75 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
NEGATIVE EDGE
Width
5.3 mm
3.9 mm
fmax-Min
225 MHz
150 MHz
Base Number Matches
1
1
Pbfree Code
Rohs Code
JESD-609 Code
e4
Max Frequency@Nom-Sup
150000000 Hz
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
Package Equivalence Code
SOP16,.25
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
5.9 ns
Terminal Finish
NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s)
30
Compare N74LVC109DB with alternatives
Compare SN74LVC112ADRE4 with alternatives