N74LVC109D vs SN74LVC112ADRG4 feature comparison

N74LVC109D NXP Semiconductors

Buy Now Datasheet

SN74LVC112ADRG4 Texas Instruments

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code SOIC SOIC
Package Description SOP, SOP, SOP16,.25
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type J-KBAR FLIP-FLOP J-K FLIP-FLOP
Number of Bits 2 2
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 7.5 ns 7.1 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE NEGATIVE EDGE
fmax-Min 225 MHz 150 MHz
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e4
Length 9.9 mm
Max Frequency@Nom-Sup 150000000 Hz
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP16,.25
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 5.9 ns
Seated Height-Max 1.75 mm
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm

Compare N74LVC109D with alternatives

Compare SN74LVC112ADRG4 with alternatives