N74LVC00ADB
vs
SN74LS33NDS
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Package Description
SSOP,
DIP, DIP14,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LS
JESD-30 Code
R-PDSO-G14
R-PDIP-T14
Length
6.2 mm
18.86 mm
Load Capacitance (CL)
50 pF
Logic IC Type
NAND GATE
NOR GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
IN-LINE
Propagation Delay (tpd)
5 ns
28 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
5.08 mm
Supply Voltage-Max (Vsup)
3.6 V
5.25 V
Supply Voltage-Min (Vsup)
1.2 V
4.75 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
NO
Technology
CMOS
TTL
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.65 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
5.3 mm
7.62 mm
Base Number Matches
1
3
Rohs Code
JESD-609 Code
e0
Output Characteristics
OPEN-COLLECTOR
Package Equivalence Code
DIP14,.3
Schmitt Trigger
NO
Terminal Finish
TIN LEAD
Compare N74LVC00ADB with alternatives
Compare SN74LS33NDS with alternatives