N74LV11PW
vs
74LV11PW
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
PHILIPS SEMICONDUCTORS
Package Description
TSSOP,
TSSOP, TSSOP14,.25
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LV/LV-A/LVX/H
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
Length
5 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
AND GATE
AND GATE
Number of Functions
3
Number of Inputs
3
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
27 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
1 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.635 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
Base Number Matches
1
2
Rohs Code
JESD-609 Code
e0
Max I(ol)
0.008 A
Package Equivalence Code
TSSOP14,.25
Prop. Delay@Nom-Sup
27 ns
Schmitt Trigger
NO
Terminal Finish
Tin/Lead (Sn/Pb)
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