N74LS765N
vs
AM2964CDMB
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
ADVANCED MICRO DEVICES INC
|
| Package Description |
DIP, DIP40,.6
|
DIP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| JESD-30 Code |
R-PDIP-T40
|
R-CDIP-T40
|
| JESD-609 Code |
e0
|
|
| Number of Terminals |
40
|
40
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP40,.6
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
TTL
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
4
|
1
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
40
|
| ECCN Code |
|
3A001.A.2.C
|
| Address Bus Width |
|
16
|
| Boundary Scan |
|
NO
|
| External Data Bus Width |
|
|
| Length |
|
52.324 mm
|
| Low Power Mode |
|
NO
|
| Memory Organization |
|
176K X 8
|
| Number of Banks |
|
4
|
| Seated Height-Max |
|
5.715 mm
|
| Supply Current-Max |
|
164 mA
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
4.5 V
|
| Width |
|
15.24 mm
|
| uPs/uCs/Peripheral ICs Type |
|
MEMORY CONTROLLER, DRAM
|
|
|
|
Compare N74LS765N with alternatives
Compare AM2964CDMB with alternatives