N74LS20F
vs
CD74HCT04PWR
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TEXAS INSTRUMENTS INC
|
Package Description |
DIP, DIP14,.3
|
GREEN, PLASTIC, TSSOP-14
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
LS
|
HCT
|
JESD-30 Code |
R-GDIP-T14
|
R-PDSO-G14
|
JESD-609 Code |
e0
|
e4
|
Load Capacitance (CL) |
15 pF
|
50 pF
|
Logic IC Type |
NAND GATE
|
INVERTER
|
Max I(ol) |
0.008 A
|
0.0052 A
|
Number of Functions |
2
|
6
|
Number of Inputs |
4
|
1
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
TSSOP
|
Package Equivalence Code |
DIP14,.3
|
TSSOP14,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Power Supply Current-Max (ICC) |
2.2 mA
|
0.04 mA
|
Prop. Delay@Nom-Sup |
15 ns
|
29 ns
|
Propagation Delay (tpd) |
15 ns
|
29 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Schmitt Trigger |
NO
|
NO
|
Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.75 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
TTL
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
1
|
3
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Package Code |
|
TSSOP
|
Pin Count |
|
14
|
ECCN Code |
|
EAR99
|
Samacsys Manufacturer |
|
Texas Instruments
|
Length |
|
5 mm
|
Moisture Sensitivity Level |
|
1
|
Packing Method |
|
TR
|
Peak Reflow Temperature (Cel) |
|
260
|
Seated Height-Max |
|
1.2 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Width |
|
4.4 mm
|
|
|
|
Compare N74LS20F with alternatives
Compare CD74HCT04PWR with alternatives