N74LS157B
vs
54LS157DMQB
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
DIP, DIP16,.3
|
CERAMIC, DIP-16
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Family |
LS
|
LS
|
| JESD-30 Code |
R-PDIP-T16
|
R-GDIP-T16
|
| JESD-609 Code |
e0
|
|
| Load Capacitance (CL) |
15 pF
|
15 pF
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Max I(ol) |
0.008 A
|
0.004 A
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
16 mA
|
16 mA
|
| Prop. Delay@Nom-Sup |
27 ns
|
23 ns
|
| Propagation Delay (tpd) |
27 ns
|
23 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
3
|
4
|
| Length |
|
19.43 mm
|
| Screening Level |
|
MIL-STD-883 Class B
|
| Seated Height-Max |
|
5.08 mm
|
| Width |
|
7.62 mm
|
|
|
|
Compare N74LS157B with alternatives
Compare 54LS157DMQB with alternatives