N74LS136N vs HD74LS136P feature comparison

N74LS136N NXP Semiconductors

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HD74LS136P Renesas Electronics Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS RENESAS TECHNOLOGY CORP
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-PDIP-T14 R-PDIP-T14
JESD-609 Code e0 e0
Logic IC Type XOR GATE XOR GATE
Max I(ol) 0.008 A 0.008 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 70 °C 75 °C
Operating Temperature-Min -20 °C
Output Characteristics OPEN-COLLECTOR OPEN-COLLECTOR
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 10 mA 10 mA
Prop. Delay@Nom-Sup 30 ns 30 ns
Propagation Delay (tpd) 30 ns 30 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL EXTENDED
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 4 2
Rohs Code No
Part Package Code DIP
Pin Count 14
Length 19.2 mm
Seated Height-Max 5.06 mm
Width 7.62 mm

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