N74LS00N vs T74LS00B1 feature comparison

N74LS00N NXP Semiconductors

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T74LS00B1 STMicroelectronics

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS STMICROELECTRONICS
Package Description DIP, DIP14,.3 PLASTIC, DIP-14
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-PDIP-T14 R-PDIP-T14
JESD-609 Code e0 e0
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.008 A 0.008 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Characteristics TOTEM POLE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 4.4 mA 4.4 mA
Prop. Delay@Nom-Sup 15 ns 15 ns
Propagation Delay (tpd) 15 ns 15 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 1
Pbfree Code No
Rohs Code No
Part Package Code DIP
Pin Count 14
Load Capacitance (CL) 15 pF
Seated Height-Max 5.1 mm
Width 7.62 mm

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