N74F827D,602 vs AM29C827APC feature comparison

N74F827D,602 NXP Semiconductors

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AM29C827APC Rochester Electronics LLC

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Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code SOP
Package Description 7.50 MM, PLASTIC, MS-013, SOT137-1, SOP-24 DIP,
Pin Count 24
Manufacturer Package Code SOT137-1
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH DUAL OUTPUT ENABLE WITH DUAL OUTPUT ENABLE
Control Type ENABLE LOW
Family F/FAST CMOS
JESD-30 Code R-PDSO-G24 R-PDIP-T24
JESD-609 Code e4
Length 15.4 mm 30.734 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.064 A
Moisture Sensitivity Level 1
Number of Bits 10 10
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 24 24
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP24,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Power Supply Current-Max (ICC) 100 mA
Prop. Delay@Nom-Sup 18 ns
Propagation Delay (tpd) 14 ns 15.5 ns
Qualification Status Not Qualified
Seated Height-Max 2.65 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology TTL CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 7.5 mm 7.62 mm
Base Number Matches 1 1

Compare N74F827D,602 with alternatives

Compare AM29C827APC with alternatives