N74F786N,602
vs
I74F786N
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
DIP
DIP
Package Description
0.300 INCH, PLASTIC, DIP-16
DIP, SOP16,.25
Pin Count
16
16
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.31.00.01
Factory Lead Time
4 Weeks
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
JESD-609 Code
e4
e4
Number of Terminals
16
16
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
SOP16,.25
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max
80 mA
80 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
NICKEL PALLADIUM GOLD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
uPs/uCs/Peripheral ICs Type
SYSTEM INTERFACE LOGIC, BUS ARBITER AND CONTINUOUS SIGNAL GENERATOR
SYSTEM INTERFACE LOGIC, BUS ARBITER AND CONTINUOUS SIGNAL GENERATOR
Base Number Matches
1
2
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N74F786N,602 vs N74F786N
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N74F786N,602 vs N74F786D
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