N74F779D
vs
MC74F779ND
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
SOIC
|
|
| Package Description |
PLASTIC, SOT-162-1, SO-16
|
DIP, DIP16,.3
|
| Pin Count |
16
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Additional Feature |
TCO OUTPUT; MULTIPLEXED I/O
|
|
| Count Direction |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
| Family |
F/FAST
|
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDIP-T16
|
| Length |
10.3 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Load/Preset Input |
YES
|
YES
|
| Logic IC Type |
BINARY COUNTER
|
BINARY COUNTER
|
| Max Frequency@Nom-Sup |
115000000 Hz
|
|
| Max I(ol) |
0.024 A
|
|
| Mode of Operation |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Number of Bits |
8
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP16,.4
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
128 mA
|
|
| Propagation Delay (tpd) |
11 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2.65 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
|
| Width |
7.5 mm
|
|
| fmax-Min |
115 MHz
|
|
| Base Number Matches |
3
|
3
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Power Supplies |
|
5 V
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare N74F779D with alternatives