N74F764AA-T
vs
N74F765-1A-T
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
PHILIPS COMPONENTS
|
PHILIPS SEMICONDUCTORS
|
| Package Description |
,
|
QCCJ, LDCC44,.7SQ
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
18
|
|
| Boundary Scan |
NO
|
|
| Bus Compatibility |
68020; 68000 FAMILY; 8086; Z80
|
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQCC-J44
|
S-PQCC-J44
|
| Low Power Mode |
NO
|
|
| Memory Organization |
256K X 1
|
|
| Number of Banks |
1
|
|
| Number of Terminals |
44
|
44
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
210 mA
|
170 mA
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
4.5 V
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
TTL
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Position |
QUAD
|
QUAD
|
| uPs/uCs/Peripheral ICs Type |
MEMORY CONTROLLER, DRAM
|
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Package Code |
|
QCCJ
|
| Package Equivalence Code |
|
LDCC44,.7SQ
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Pitch |
|
1.27 mm
|
|
|
|
Compare N74F764AA-T with alternatives